Precision-Engineered Solutions for Semiconductor & Electronics Manufacturing
As an experienced vendor in the semiconductor and fabrication industries, we are equipped with the technical expertise and proven problem-solving methodologies to effectively support our customers’ needs.
Our Process Capabilities
Die Attach
We supply precision-engineered tools for die bonding processes, ensuring consistent alignment, stable positioning, and accurate material placement. Our fixtures and supports are built to minimize handling errors and enhance throughput in both manual and automated bonding systems.
Wire Bond
Our custom fixtures are designed to support fine-pitch and high-density wire bonding applications. We manufacture parts such as bond clamps, platforms, and supports tailored to your bonding system and chip specifications, ensuring stability, heat resistance, and repeatability.
Custom Design
Other custom-designed solutions include carriers, magazines, and shear tools — all tailored to meet specific handling, storage, and cutting requirements within semiconductor and precision manufacturing processes.